spec no: dsab0429 rev no: v.4 date: mar/18/2005 page: 1 o f 4 approved: j. lu checked: allen liu drawn: j.f.wang package dimension s kpd - 3224sgc super bright green 3.2x2.4mm smd chip led lamp features 3.2x2.4mm smt led, 2.4mm thickness. low power consumption. ideal for backlight and indicator. various colors and lens types available. package : 1500pcs / reel. notes: 1. all dimensions are in millimeters (inches). 2. tolerance is 0 .1(0.004") unless otherwise noted. 3.specifications are subject to change without notice. description the super bright green source color devices are made with gallium phosphide green light emitting diode.
spec no: dsab0429 rev no: v.4 date: mar/18/2005 page: 2 o f 4 approved: j. lu checked: allen liu drawn: j.f.wang selection guid e note: 1. 1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. electrical / optical characteristics at t a =25 c absolute maximum ratings at t a =25 c note: 1. 1/10 duty cycle, 0.1ms pulse width. part no. dice lens type iv (mcd) @ 20ma viewing angle min. typ. 2 ? 1/2 kpd - 3224sgc super bright green (gap) water clear 18 70 20 symbol parameter device typ. max. test conditions units peak peak wavelength super bright green 565 nm i f =20ma d dominant wavelength super bright green 568 nm i f =20ma ? 1/2 spectral line half - width super bright green 30 nm i f =20ma c capacitance super bright green 15 pf v f =0v;f=1mhz v f forward voltage super bright green 2.2 2.5 v i f =20ma i r reverse current super bright green 10 ua v r = 5v parameter super bright green units power dissipation 105 mw dc forward current 25 ma peak forward current [1] 140 ma reverse voltage 5 v operating/storage temperature - 40c to +85c
spec no: dsab0429 rev no: v.4 date: mar/18/2005 page: 3 o f 4 approved: j. lu checked: allen liu drawn: j.f.wang super bright green kpd - 3224sgc
spec no: dsab0429 rev no: v.4 date: mar/18/2005 page: 4 o f 4 approved: j. lu checked: allen liu drawn: j.f.wang tape specifications (units : mm ) recommended soldering pattern (units : mm ) kpd - 3224sgc smt reflow soldering instructions number of reflow process shall be 2 times or less and cooling process to normal temperature is required between first and second soldering process. remarks: if special sorting is required (e.g. binning based on forward voltage,luminous intensity, or wavelength), the typical accuracy of the sorting process is as follows: 1. wavelength: +/ - 1nm 2. luminous intensity: +/ - 15% 3. forward voltage: +/ - 0.1v note: accuracy may depend on the sorting parameters.
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